Fabrication of various electroless Ni-P alloy/multiwalled carbon nanotube composite films on an acrylonitrile butadiene styrene resin

Ni-P alloy/multiwalled carbon nanotube (MWCNT) composite films were fabricated on acrylonitrile butadiene styrene (ABS) resin by electroless plating and their microstructures, adhesion strengths, and friction properties were investigated. Various types of MWCNTs were used. In addition, various electroless plating baths were prepared to form Ni-P alloy matrices with various phosphorus contents. To enhance the adhesion strength, the ABS resin substrate was subjected to roughening treatment. The microstructures of the composite films were examined by scanning electron microscopy and X-ray diffraction. Their adhesion strengths were measured by tensile tests. The friction properties of the composite films were investigated using the ball-on-plate method. Ni-P alloy/MWCNT composite films containing various types of MWCNTs and with Ni-P alloy matrices having various phosphorus contents were fabricated on the ABS resin substrates by electroless deposition. The adhesion strength between the Ni-P alloy/MWCNT composite films and the ABS resin substrate was more than 1300 N cm(-2). The Ni-P alloy/MWCNT composite films had considerably lower friction coefficients than the Ni-P alloy films. The friction coefficients of the composite films were significantly affected by the type of MWCNTs used.ArticleSURFACE & COATINGS TECHNOLOGY 205: 3175-3181(2011)journal articl

Cu-MWCNT Composite Films Fabricated by Electrodeposition

Copper–multiwalled carbon nanotube (MWCNT) composite plating using a sulfuric base bath was studied. A dispersing agent was used to disperse the MWCNTs into the plating bath. The effects of electrodeposition conditions on the surface morphology, microstructure, and MWCNT content in the composite films were examined. The internal stress, hardness, electrical conductivity, and thermal conductivity of the composite films were also investigated. The current density remarkably affected the surface morphologies of the films, and a relatively smooth surface was obtained at lower current densities. The bath temperature affected the microstructure of the composite films; a compact microstructure was formed at a lower temperature. The MWCNT content in the composite film increased with increasing MWCNT concentration in the plating bath, reaching a maximum value of 0.55 mass %. However, MWCNTs in the composite films tended to agglomerate for high MWCNT concentrations in the plating bath. An internal tensile stress was induced in the films. The hardness of the films was around 150 HV, and the electrical resistivity was approximately 2–2.5μΩ cm. The thermal conductivity of the Cu–0.42 mass % MWCNT composite film was 355 W m⁻¹ K⁻¹.ArticleJOURNAL OF THE ELECTROCHEMICAL SOCIETYjournal articl

Fabrication of Various Electroless Ni-P Alloy/Multiwalled Carbon Nanotube Composite Films and Their Frictional Properties

Ni-P alloy/multiwalled carbon nanotube (MWCNT) composite films were fabricated using an electroless plating method, and their microstructures and frictional properties were studied. MWCNTs of various sizes were used and three kinds of electroless plating baths were prepared to form the Ni-P alloy matrix with varying phosphorus contents. Heat- treatments of the composite films were also carried out. The microstructures of the composite films were examined by scanning electron microscopy and X-ray diffraction. Frictional properties of the composite films were investigated using a ball-on-plate method. Ni-P alloy/MWCNT composite films with different phosphorus contents, classified as high phosphorus (12-13 mass %), medium phosphorus (6-8 mass %), and low phosphorus (2-4 mass %) types, were fabricated using electroless deposition. The Ni-P alloy/MWCNT composite films showed lower friction coefficients compared to Ni-P alloy films with the same phosphorus content both before and after heat-treatment. The friction coefficients of the films were affected by the microstructure and size of the MWCNTs, the composition of the Ni-P alloy matrix, and the heat-treatment.ArticleJOURNAL OF THE ELECTROCHEMICAL SOCIETY 157: D570-D576(2010)journal articl

Cu/Multiwalled Carbon Nanotube Composite Films Fabricated by Pulse-Reverse Electrodeposition

Cu/multiwalled carbon nanotube (MWCNT) composite plating by a pulse-reverse (PR) electrodeposition method was investigated in order to increase the MWCNT content of the composite plating films. The electrodeposition and dissolution behaviors of the composite films were investigated using scanning electron microscopy and X-ray diffraction to determine the most suitable electrodeposition and dissolution current densities for PR electrodeposition. PR electrodeposition of the Cu/MWCNT composite films was conducted by varying the current reverse ratios at the most suitable electrodeposition and dissolution current densities. The surface morphology of the Cu/MWCNT composite films after dissolution was significantly changed by variation of the anodic current densities. The MWCNT content of the composite films formed by PR electrodeposition was greater than that obtained using a direct current (dc) electrodeposition method, and reached a maximum value of 0.59 mass %, which is a 40% increase over that for dc electrodeposition. Furthermore, the surface roughness of the composite films fabricated by PR electrodeposition was less than that by dc electrodeposition.ArticleJOURNAL OF THE ELECTROCHEMICAL SOCIETY 158: D49-D53(2010)journal articl

Effects of Additives on Cu-MWCNT Composite Plating Films

The effects of plating bath additives on copper-multiwalled carbon nanotube (MWCNT) composite platings were studied. An acidified cupric sulfate electrolyte containing MWCNTs and polyacrylic acid as a dispersing agent was used as the base plating bath. Chloride ions (Cl⁻), poly(ethylene glycol), bis(3-sulfopropyl)disulfide (SPS), and Janus green B (JGB) were examined as additives. The surface morphologies and cross-sectional microstructures of the electrodeposited films were investigated, and the MWCNT content of the films was determined. Furthermore, the electrical resistivity and field emission properties of the films were evaluated. The simultaneous addition of Cl⁻, SPS, and JGB to the base plating bath was effective for forming smooth Cu-MWCNT composite films with a high MWCNT content over a wider range of current densities. The optimal bath composition was 0.85 mol dm⁻³　CuSO₄・5H₂O+0.55 mol dm⁻³ H₂SO₄+100 ppm PA5000+2 g dm⁻³ MWCNTs+2 ppm SPS + 2 ppm JGB +50 ppm Cl⁻. Cu-MWCNT composite films containing 0.15–0.33 mass % MWCNTs with smooth surface morphologies were formed in the current density range of 0.5–5 A dm⁻². The electrical resistivity of the films was around 2 μΩ cm, and they showed obvious field emission properties.ArticleJOURNAL OF THE ELECTROCHEMICAL SOCIETYjournal articl

Carbon Nanotubes in historical and future perspective Summary of an Extended Session at Carbon 2008 in Nagano (JP)

The extended session on Biological Evaluations with Carbon Nanotubes was held on 18 July, 2008 in Nagano as a part of the International Carbon 2008 Conference. During this session researchers and regulators discussed recent publications that have shown significant hazards of carbon nanotubes in animal models and have received wide coverage in the lay press. The discussion focused on significance and interpretation of the data, their meaning to further development, and prevention of exposure at the workplace. The paper of Poland et al was presented and detailed by Dr. Duffin, a senior researcher at the ELEGI-COLT lab at Edinburgh University (UK). Dr. Takagi and his team did not share our discussion although they were invited to do so

Electrodeposition of Ni-P Alloy-Multiwalled Carbon Nanotube Composite Films

Ni–P alloy–multiwalled carbon nanotube (MWCNT) composite films were fabricated by an electrodeposition technique, and their microstructure, hardness, and frictional properties were analyzed. Ni–P alloy–MWCNT composite films containing 20–22 atom % P and 0.7–1.2 mass % MWCNTs were electrodeposited from a composite plating bath. MWCNTs were embedded relatively uniformly in the Ni–P alloy matrix. The hardness of the composite films was higher than that of the Ni–P alloy films, both before and after heat-treatment, and the friction coefficient of the composite films was lower than that of the Ni–P alloy films.ArticleJOURNAL OF THE ELECTROCHEMICAL SOCIETY. 157(1):D50-D53 (2010)journal articl

Metal-fixed multiwalled carbon nanotube patterned emitters using photolithography and electrodeposition technique

We have demonstrated that patterned Cu-multiwalled carbon nanotube (MWCNT) composite emitters can be fabricated using a unique electrodeposition technique including a photolithography process. Well-regulated, patterned Cu-MWCNT composite emitters 50 mu m in diameter were formed on the conductive substrates. The MWCNTs were fixed on the patterned composite emitters. The field emission properties were studied by a diode-type measurement system. The field emission electric field was relatively low (1.5 V mu m(-1) for 1x10(-5) mu A cm(-2), 2.5 V mu m(-1) for 10 mu A cm(-2)). These composite emitters can be expected to be applied in field emission displays and other field emission devices. (C) 2008 The Electrochemical Society.ArticleELECTROCHEMICAL AND SOLID STATE LETTERS. 11(9):D72-D74 (2008)journal articl

Ni-P alloy-carbon black composite films fabricated by electrodeposition

Ni-P alloy-carbon black (CB) composite films were fabricated by electroplating and their microstructures and properties were examined. The CB and phosphorus contents of the composite films were also investigated. The CB particles were found to be embedded in the Ni-P alloy matrix. The CB content in the deposits increased, reached a maximum value of 0.77 mass% with increasing CB concentration in the bath up to 10 g dm(-3), and then decreased with a further increase in the CB concentration in the bath. Both before and after heat treatment, the composite films had higher hardnesses and lower friction coefficients than the Ni-P alloy films. Both before and after heat treatment, the friction coefficient of 0.77 mass% CB composite films was about half that of Ni-P alloy films without CB.ArticleAPPLIED SURFACE SCIENCE 256: 6914-6917(2010)journal articl